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Published in Everyday Knowledge

#TecnoModular #MWC2026 #technoruhez At MWC 2026 in Barcelona, Tecno unveiled a new ultra-thin modular smartphone concept featuring a magnetic interconnection system that lets users snap on accessories like additional batteries, telephoto lenses and action cameras without adding bulk. The base device measures about 4.9 mm thick and is designed as a flexible platform that adapts to different use cases through easily attachable modules.